| Item | Electronic equipment heat sink aluminum profile |
| Material | 6063 | 6061 | 6060 |
| Temper | T5 / T6 |
| Thickness | 0.8 - 5.0 mm |
| Length | 6 m (customizable) |
| Surface Treatment | Mill Finish | Powder Coating | Anodizing | Electrophoresis | Fluorocarbon Coating | Wood Grain, etc. |
| Color | According to customer requirements (customizable) |
| Service Support | Drilling | Milling | Cutting | Welding | Bending | Assembling | CNC |
| Packing Details | Inside: packed with protective film to protect each piece |
| Outside: wrapped into bundles by shrink plastic bag | |
| Delivery Time | Die developing and sample testing: 7 - 10 days |
| Mass production completed: 15 - 30 days | |
| MOQ | 500 kg |
High-Efficiency Industrial Heat Sink Profiles
Our precision-engineered aluminum heat sink profiles deliver exceptional thermal management for demanding industrial applications. Featuring multi-channel fin design and optimized airflow geometry, these profiles provide 40% greater cooling efficiency than conventional designs while maintaining structural integrity under continuous operation.
Ideal for power electronics cooling including IGBT modules, server racks, EV charging systems, and renewable energy converters. The extruded one-piece construction ensures reliable heat dissipation in telecom infrastructure, industrial automation equipment, and medical imaging devices where temperature stability is critical.
Compatible with forced air or passive cooling configurations, these profiles meet international standards for high-power density applications across global markets.